What is thermal conductive double-sided tape?

Thermal conductive double-sided tape, also known as thermal tape, is coated with a mixture of acrylic polymer and thermally conductive ceramic powder. It features high thermal conductivity and insulation properties, along with flexibility, conformability, strong adhesion, and a wide temperature tolerance range. It can fill uneven surfaces, ensuring tight bonding between heat sinks and heat sources. This transforms air-based heat transfer into thermal adhesive-based heat transfer.

Thermal double-sided tape can be categorized into substrate-based and substrate-free types based on manufacturing materials. MINORU's substrate-based thermal double-sided tape further divides into PET substrate and PI substrate variants. The image below displays representative models of our various product lines.

Compared to backing-free double-sided tape, backing-type thermal conductive double-sided tape offers superior workability due to its intermediate backing layer, which provides structural support and facilitates easier application. In contrast, backing-free tape, consisting entirely of adhesive after release liner removal, achieves tighter adhesion and better penetration with substrates, demonstrating superior wetting properties. Precisely because backing-free thermal tape excels at absorbing surface irregularities and effectively expelling air from bonding gaps, it delivers superior thermal performance and greater practicality under equivalent conditions compared to backed variants. The specific choice ultimately depends on the actual application scenario and cost considerations.

Thermal conductive double-sided tape offers simple and convenient operation with high efficiency. To use, simply peel off the release liner from the tape's surface, then press the adhesive side firmly onto the device surface for immediate bonding. This eliminates the need for mechanical fasteners or liquid adhesive curing between electronic components and heat sinks. Consequently, it finds extensive application in heat sinks, thermal modules, CPU microprocessor cooling, LED lighting heat dissipation, and filling gaps between PCBs, metal components, and enclosures. Beyond bridging uneven surfaces, it simultaneously conducts heat away. Even in confined spaces, no structural modifications are required for installation, fully leveraging this thermal material's heat conductivity and the convenience of pressure-sensitive adhesive tape.

The image below shows the application of MINORU 51010H in automotive settings.