Product Description

The MINORU SFPxx series is a one-component, silicone-free thermal gap filler. Formulated to be silicone-free, it features excellent crack and sag resistance, ensuring compatibility with a wide range of electronic devices. Once cured, it maintains a flexible texture with moderate tack, providing outstanding reworkability and assembly performance.

Features

• Single-component material; no secondary curing required, making it ideal for automated production.

• Superior flexibility and extremely low residual stress, optimized for low-pressure assembly.

• High reliability with exceptional thermal stability.

Handling Precautions

• Fire Safety: Keep product storage and installation areas away from open flames or ignition sources.

• Verification: Thoroughly verify product suitability and compatibility for your specific application prior to full-scale operation.

• Surface Preparation: Ensure the bonding interface is clean and free of contaminants (dust, oil, or debris) before application.

• Dispensing: We recommend using a pneumatic dispensing machine for direct application; alternatively, use an equivalent direct coating process.

Why choose silicone-free products?

Application ideas