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Product Description
TGF series is a thermally conductive Gap Filler. With special formula, it has low volatility characteristics and anti-cracking, anti-drape characteristics, especially for the many electronics applications. It is ultra-soft and has good tack which is easy to rework and easy for assembly.
Characteristics:
One-component material, no post-curing, suitable for automated operation
High reliability and thermal stability
Low oil penetration properties, no pump-out
Soft, low assembly pressure and low residual stresses
Application Fields:
Automotive Electronics
Power switches
Motor Control
Power Semiconductors
Power Modules
Mass Storage Data Centre
Memory modules
Smart terminals, mobile phones, tablet PCs

One Part Thermal Gap Filler TGFxx Series
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