Product Description

5505-xx&5507-xx&5508-xx&5510-xx series are phase change thermal pad. When heated to 45℃, it will undergo a phase change and become soft, maximizing wetting and filling of the substrate surface, thereby reducing the interface thermal resistance. MINORU phase change material (PCM) is available in both pad and paste formats, It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Based on a robust polymer PCM structure, this material exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance, making PCM desirable for high-performance integrated circuit devices.

Features

• High performance filler and polymer technology

• Silicone-free, no pump out, bleed out, dry out issues

• Thermally Conductive Fillers loading to optimize performance

• Industry-proven superior long-term reliability

• Min BLT~20um, typical BLT is below 50um

• 30~40 psi pressure is needed for usage

Application

• AI/PC

• Networks

• Notebook/PC

• Telecom/Data Center

• Consumer Electronics

• Memory Modules

• IGBTs

• Automotive

PCM thermal pad