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Product Description
MINORU TGxx series thermally conductive PAD can used between electronic devices and heat sink interfaces. TGxx series products have good compression and thermal conductivity which enable them to fill the gap between the electronic components and the heat sink at very low pressure. It has slight tack that enable easy pre-assembly.
Characteristics :
High thermal conductivity, low thermal resistance
High AC withstand voltage value
High conformability
Good resilience, high long-term reliability
Multiple thickness options, wide range of applications
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Typical Applications :
Power switch module
Automotive control units
Universal high voltage interfaces
Engine control units
Power Conversion Devices
Power Semiconductors - MOSFETs and IGBTs
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