Name: Two parts silicon gap filler
SKU: 0

kaneda@Minoru-japan.co.jp

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LOCATION : Thermal Management Materials - Two parts silicon gap filler

Two parts silicon gap filler

TGFxxD series is a two-component thermally conducive gap filler, It requires the mixing of Part A and Part B resins to cure into a soft, thermallyconducive interface material. This system offiers deep section cure, excellent thermal stability, and structural integrity, making it suitable forlarge-gap applications and automated dispensing.

Email：kumazawa@minoru-japan.co.jp

Email：kaneda@Minoru-japan.co.jp

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Product Details

Product Description

Characteristics:

Two-component material, requires mixing, room temperature or heat cure
High thermal conductivity and reliability
Adjustable pot life and cure time
Low oil bleeding, minimal shrinkage during cure
Soft.conformable,low stress on components

Application Fields:

Automotive Electronics (ECU, Battery Packs)
Power Supplies &Inverters
Motor Drives & Controllers
Telecom Base Stations
LED Lighting drivers
Large-scale energy storage systems

Two parts silicon gap filler

Property	TGF02D	TGF04D	TGF06D	TGF08D	TGF10D	Test method
Construction	Ceramic filled silicone	Ceramic filled silicone	Ceramic filled silicone	Ceramic filled silicone	Ceramic filled silicone	−
Color	A：White B：Yellow	A：White B: Blue	A：White B：Red	A：White B：Pink	A：Dark Grey B：Light Grey	--
Viscosity Pa.s	A 400 B 400	A 400 B 400	A 400 B 400	A 400 B 400	A 400 B 400	DIN53019
Minimum Bond Line Thickness (mm)	0.06	0.1	0.2	0.15	0.15	−
Mixing Ratio	1:1	1:1	1:1	1:1	1:1	--
Curing Time	48 Hrs（Room Temp） 30 Mins（120°C）	48 Hrs（Room Temp） 30 Mins（120°C）	48 Hrs（Room Temp） 30 Mins（120°C）	48 Hrs（Room Temp） 30 Mins（120°C）	48 Hrs（Room Temp） 30 Mins（120°C）	--
Density (g/cc)	2.8	3.1	3.3	3.3	3.2	ASTM D792
shore00	55	50	50	50	50	ASTM D2240
Operating Temperature Range (°C)	-50°C∽200°C	-50°C∽200°C	-50°C∽200°C	-50°C∽200°C	-50°C∽200°C	--
Dielectric Strength(Kv/mm)	≥10	≥10	≥7	≥6	≥6	ASTM D149
Dielectric Constant (1GHz)	5.9	6.1	6.4	7.1	7.8	ASTM D150
Flame Rating	V0	V0	V0	V0	V0	UL 94
Thermal Conductivity ( W/m-K)	2	4	6	8	10	ASTM D5470
volume resistance ohm-cm	＞10¹³	＞10¹³	＞10¹³	＞10¹³	＞10¹³	ASTM D257

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