5505-xx&5507-xx&5508-xx&5510-xx series are phase change thermal pad. When heated to 45℃, it will undergo a phase change and become soft, maximizing wetting and filling of the substrate surface, thereby reducing the interface thermal resistance. MINORU phase change material (PCM) is available in both pad and paste formats, It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Based on a robust polymer PCM structure, this material exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance, making PCM desirable for high-performance integrated circuit devices.

TGFxxD series is a two-component thermally conducive gap filler, It requires the mixing of Part A and Part B resins to cure into a soft, thermallyconducive interface material. This system offiers deep section cure, excellent thermal stability, and structural integrity, making it suitable forlarge-gap applications and automated dispensing.

MINORU thermally conductive absorber has low thermal resistance and  The high permeability and magnetic loss help reduce EMI/RFI noise and improve signal integrity that could interfere with a system's operations.

The MINORU SFPxx series is a one-component, silicone-free thermal gap filler. Formulated to be silicone-free, it features excellent crack and sag resistance, ensuring compatibility with a wide range of electronic devices. Once cured, it maintains a flexible texture with moderate tack, providing outstanding reworkability and assembly performance.